University at Buffalo
212 Ketter Hall
Buffalo, NY 14260
PH: (716) 645-2114, ext. 2429
Web: http://www.packaging.buffalo.edu
E: cjb@buffalo.edu
102 Ketter Hall, 119 Bonner Hall, 103 Jarvis
Buffalo, NY 14260
PH: (716) 645-2114, ext. 2507
Affiliations
University at Buffalo
102 Ketter Hall
Buffalo, NY 14260
PH: (716) 645-2114, ext. 2429
Web: http://www.packaging.buffalo.edu/
E: cjb@buffalo.edu
Research
Molecular Dynamic Simulations Model
Electronic packaging; electromigration; thermomigration; electronics reliability.
High Sensitivity Moire Interferometry
Finite Element Analysis, And Molecular Dynamic Simulations. ABAQUS, ANSYS, LAMMS
Dr. Basaran specializes in experimental and computational damage mechanics of Nano and power electronics packaging. He has authored more than 130 publications in the field of high sensitivity moiré interferometry inspection and thermodynamics based damage mechanics of electronics packaging. Recently he has been working on electromigration and thermomigration induced failure of nanoelectronics. He is developing computational models for electromigration and thermomigration of metals and Carbon Nano Tubes. He is using Finite element Method and Molecular Dynamic Simulations.